According to a market report, published by Sheer Analytics and Insights, The Global Outsourced Semiconductor Assembly and Test (OSAT) Market was valued at $45.3 billion in 2022 and it is expected to reach $90.1 billion at a CAGR of 7.1% between 2022 and 2032. Outsourcing has a significant role in the semiconductor business as well. The manufacturing portion of developing a semiconductor product depends more on the assistance of outside vendors than the designing portion does. FABs and OSATs are the two notable instances of semiconductor outsourcing. Additionally, advancements in packaging platforms, such as fan-out packaging and 3D flip chip technology, are being fueled by the expanding commercialization of applications like AI and 5G to solve the demand for high power consumption and deliver advantages like improved chip communication. Due to this, many businesses must work with OSAT vendors.
The need for OSAT is driven by the developing transition in industrialized nations, the rapid uptake of smartphones, and the increased use of electronics. Further boosting OSAT growth is technology advancement combined with rising purchasing power in the emerging world. Additionally, the fact that OSAT businesses are predominately involved in IC assembly and testing presents several chances for market competitors to strengthen their position in the industry. Moreover, the number of semiconductor products per car is rising, and innovations like autonomous and electric vehicles are now major motivators for OSAT providers and semiconductor producers. The potential for OSAT and semiconductor foundries is growing as more semiconductor components, like microcontrollers, sensors, and radar chips, are used in the car industry. Semiconductor devices form the backbone of the hardware required to run the software for the creation of electric, hybrid, autonomous, and alternative-fuel vehicles.
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Furthermore, the worldwide automotive industry remains one of the main drivers and prospects for semiconductor and OSAT providers despite the recent recession and demand volatility. For semiconductor producers and OSAT suppliers, developments like autonomous and electrified vehicles as well as the rising number of semiconductor components per vehicle are now the main driving forces. Additionally, the demand for multiple advanced-level semiconductor packaging is driven by trends like driverless cars and V2X, which are fueling the growth of the sector for outsourced semiconductor assembly and test services. These primary factors are expected to create more growth opportunities for the OSAT market in the future.
However, some factors could hamper the market's growth in the future. A supply chain gap in the semiconductor industry has been caused by several factors, including the US-China trade war. The issue makes waiting times longer. Numerous wafer foundries and semiconductor firms are driven by this market dynamic to vertically integrate their packaging and testing activities to provide end users with single-point solutions. The emergence of such situations is one of the primary reasons OSATs view the arrival of foundries like Intel, Samsung, and TSMC into the IC packaging business as a potential threat to their earnings.
Some new developments in the global OSAT market:
Advantest introduced a special AI-powered software solution to quicken yield enhancement in IC engineering and manufacturing. A wide range of users, including chip designers and outsourced semiconductor assembly and test (OSAT) organizations, can benefit from this by increasing the productivity of both device engineering and production processes.
In order to influence future developments in semiconductors and systems, TSMC established the OIP 3DFabric partnership. With the aid of TSMC's 3DFabric technologies, a broad family of 3D silicon stacking and cutting-edge packaging technologies, users will be able to quickly integrate innovations at the silicon and system level and enable next-generation HPC and mobile applications.
According to the study, key players dominating the global OSAT market are Amkor Technology (U.S), Advanced Technologies Inc (U.S), ASE Group (Taiwan), ChipMos Technologies (Taiwan), Hana Micron (South Korea), JCET (China), King Yuan Electronics (Taiwan), Powertech Technology (Taiwan), Signetics (South Korea), Unisem Group (Malaysia), Walton Advanced Engineering (Taiwan), among others.
The Global Outsourced Semiconductor Assembly and Test (OSAT) Market Has Been Segmented Into:
The Global Outsourced Semiconductor Assembly and Test (OSAT) Market – by Service Type:
Testing
Packaging
Others
The Global Outsourced Semiconductor Assembly and Test (OSAT) Market – by Application Type:
Communication
Computer & Networking
Consumer Electronics
Industrial Electronics
Others
The Global Outsourced Semiconductor Assembly and Test (OSAT) Market – by Regions:
North America
The U.S.
Canada
Mexico
Europe
The U.K.
France
Germany
Italy
Rest of Europe
Asia Pacific
India
China
Japan
Australia
Rest of Asia Pacific
LAMEA
Middle East
Saudi Arabia
UAE
Others
Latin America
Brazil
Chile
Others
Africa
South Africa
Egypt
Other
Browse the full report at https://www.sheeranalyticsandinsights.com/market-report-research/osat-market-21
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